INSIDE Contactless, a world leader for contactless semiconductor chips
and hardware platforms, today announced its cooperation with Infineon
Technologies on the development of a joint reference architecture for
next generation, interoperable NFC solutions.
The cooperation combines the strengths and strategies of both companies
to reinforce the current adoption of contactless payment and
communications technologies worldwide and ensures smooth
interoperability between the transceiver of INSIDE Contactless and the
security micro-controllers of Infineon especially for NFC applications.
The planned reference architecture will notably combine INSIDE’s NFC
capacities with Infineon’s secured connectivity technology, allowing
banking services to converge on the handset. This will provide new
opportunities for handset manufacturers, telecom operators, banks and
others media, travel and entertainment industry to develop new mass
market services.
With major industry back up in their respective fields of application,
INSIDE Contactless and Infineon have decided to join forces in order to
further extend the integration of their technologies, and create a
favorable ground for the deployment of a new industrial ecosystem, based
on new banking and telecommunications services. This way, INSIDE’s
product offering will become fully interoperable with the Mifare
protocol, opening a wide spectrum of services, especially in the
transport industry.
“Cooperating with the leading semiconductor supplier offering security
in silicon fully demonstrates our capacity to deploy wide-scale,
open-standard NFC projects, and is a great opportunity for INSIDE
Contactless” says Philippe Martineau, Executive Vice President, NFC
business line for INSIDE Contactless. “Interoperability with Mifare will
improve our capacity to deliver flexible solutions to our clients across
the world, and act as market facilitator for NFC adoption.”
“NFC has the potential to complement today’s contactless applications,”
said Dr. Helmut Gassel, Vice President und General Manager, Chip Card &
Security ICs at Infineon Technologies. “The joint efforts of Infineon
and INSIDE Contactless may speed up NFC deployment to bring convenient
and secure payment to mobile devices .”
About INSIDE Contactless:
Founded in 1995, INSIDE is headquartered in France and with global
presence in China, Singapore, Poland and the USA. INSIDE is uniquely
positioned as the only fabless semiconductor company solely dedicated to
the advancement of contactless technology, leveraging one of the
industry’s largest intellectual property portfolios. Through strategic
emphasis in Contactless Payments and Near Field Communications (NFC),
INSIDE has been on a rapid growth track over the past two years with
more than 12M chips delivered for contactless payment cards in the US
market and a dominant position in driving NFC standardization and pilot
deployments.
