NY-based HYPR is releasing its Biometric Security Integration Kit, an end-to-end biometric security suite intended for developers and manufacturers across the ever-expanding Internet of Things (IoT). The kits are expected to ship in July in the U.S., Canada, and Europe.
The kit contains all components necessary for securing both applications and devices across the IoT in a sector-agnostic manner.
• Embedded future-proof security: HYPR operates as an “under-the-hood” security solution that enables applications to link with compatible, FIDO-Ready devices and biometric sensors such as voice analyzers, facial recognition detectors, and fingerprint readers. By embedding HYPR into their products, developers and manufacturers can achieve future-proof security that seamlessly works with any current or future compliant biometric devices. This level of authentication technology, once only available to large enterprises and government agencies, is now available to individuals as an easy-to-deploy kit.
• “Drop-in” IoT solution: Device manufacturers across the evolving Internet of Things will benefit by having a “drop-in” security solution that immediately links their products with the biometric sensors on the hardware layer of the IoT stack.
• Added security, reduced cost: Application developers benefit by seamlessly embedding HYPR as an invisible and interoperable solution into their software to provide remotely impenetrable biometric authentication, eliminating the extra costs of add-on security solutions and potential breaches.
• Seamless biometric upgrade: Enterprises, financial services providers, payment platforms, government agencies and entities across the healthcare industry are able to use the HYPR protocol to upgrade seamlessly towards a fully biometric-secured environment – in either a BYOD or security token delivery method. The token, included in the integration kit, is also a stand-alone product for public and private enterprises that require the highest degree of security including biometric tokenization in a FIPS 140-2 Level 3 compliant form factor.
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